Ceramic Grinding – from Structural to Biomedical and Beyond
Prof. Albert J. Shih
Professor, Power Mechanical Engineering, National Tsing Hua University,Taiwan
Professor, Mechanical Engineering, University of Michigan at Ann Arbor,USA

Biography
    Albert Shih is Professor in Power Mechanical Engineering at National Tsing Hua University as well as in Mechanical Engineering at the University of Michigan.  He received PhD from Purdue University in 1991 and was a manufacturing engineer at Cummins and an Associate Professor at NC State University before joining the University of Michigan in 2003.  He served in the Advanced Manufacturing National Program Office in 2017 and was the President of NAMRI SME from 2019-2020.  Dr. Shih is a pioneer in biomedical manufacturing.  He is the recipient of the Fulbright Scholar, SME Taylor Research Medal and Education Award, and ASME Milton Shaw Manufacturing Research Medal, Blackall Machine Tool & Gage Award, and William Ennor Manufacturing Technology Award as well as the Editor-in-Chief of ASME Journal of Manufacturing Science and Engineering.  Professor Shih is a Fellow of ASME, SME, and CIRP.

 

Precision machining of ceramics molds using engineering tool
Prof. Hirofumi Suzuki
Professor, Manufacturing Development Innovation Center and Mechanical Engineering at Chubu University, Japan

 

 

 

Biography
    Hirofumi Suzuki is Professor in Manufacturing Development Innovation Center and in Mechanical Engineering at Chubu University.
He had been developing the mechanical manufacturing technologies on aspheric optics for electric and information devices in Mitsubishi Electric Corporation from 1985-1996. He received PhD from Tohoku University in 1997. He was researching about new manufacturing technology of aspherical glass optics in National Defence Academy, Toyohashi University Technology and Kobe University from 1996-2008 and he has been a professor of Chubu University from 2008.
He is a pioneer in ultraprecision machining process of diamond cutting, ultraprecision grinding, ultraprecision polishing, glass molding, and measurement for the aspheric optics. He is a member of Japan Society of Abrasive Technology (JSAT), JSPE, JSME, euspen and, he is a fellow of ICAT and CIRP. He had chaired ISAAT2017 Okinawa, Japan in 2017.

 

Intelligent Recommendation System of Grinding Wheel Specification

Dr. Chien-Chung Teng
Director, Sales Department of Abrasive B.U., KINIK Company, Taiwan

 

 

 

 

Biography
    Shark, Chien-Chung Teng is Director, Sales Department of Abrasive B.U., KINIK Company, Taiwan. He received Ph.D. from Nanoscience and nanotechnology Ph.D. program of Northern Illinois University, US in 2009. He investigated the TTV (Total Thickness Variation) of the ultra-precision grinding of Si wafers by kinematics analysis and computer simulation as studying his master degree at Department of Power Mechanical Engineering, National Tsinghua University, Taiwan, before joining KINIK Company in 2001. He develops, produces and sales diamond related tools for 22 years as serving in KINIK.

 

Energy conservation and Carbon reduction from Smart Manufacturing – A new generation of smart factory

Dr. Da-Jeng Yao
General Director of Mechanical and Mechatronics System Lab (MMSL) at Industrial Technology Research Institute, Taiwan.

 

 

 

Biography

    Dr. Yao received his Ph.D. from Department of Mechanical and Aerospace Engineering, University of California at Los Angeles (UCLA) in 2001. After joining National Tsing Hua University, his research focused on fertilization on a chip, intelligent gas sensing system, EWOD and digital microfluidic system, and Tera Hertz system development. More than 130 journal papers were published at top journal among this research field, including Biosensors and Bioelectronics, Biomicrofludics, Nanotechnology, Applied Energy, Journal of Micromechanics and Microengineering, and Lap on a chip, etc.
On Aug. 2021, he was invited to serve as General Director of Mechanical and Mechatronics System Lab (MMSL) at Industrial Technology Research Institute, Taiwan. The goal of institute is going to conduct and develop advanced research for industries, involving smart and green manufacturing, Autonomous and electronic car (EV), Robotics, Drone, Railway systems, and Aerospace industry.
e got Wu-Da-Yu Memorial Award (Young Investigator) from National Science Council in 2009, Shen-Yin award in 2010, and Young Researcher from Society of Theoretical and Applied Mechanics of the Republic of China in 2011, National Innovation Award in 2012 and in 2014, 2^nd prize of Xprize (US10M award) by Qualcomm with HTC team in 2017, MOST excellent research award in 2020, Excellent Engineering Professor Award from Chinese Society of Mechanical Engineers (CSME) in 2021, and 2022 Gold medal of excellent research award from ITRI. He was awarded as ASME fellow since 2013, and RSC fellow since 2018.

 

Planarization CMP technology – between Art and Science

Prof. Syuhei Kurokawa
Professor, Department of Mechanical Engineering, Kyushu University, Japan

 

 

 

 

Biography
    Syuhei Kurokawa is currently a Professor in Department of mechanical Engineering at Kyushu University, Japan. He earned his PhD Degree in Production Engineering from Kyushu University in 1992. He acted as a Visiting Professor of Laboratory for Machine Tools and Production Engineering (WZL) of the RWTH Aachen in Germany in 1998. His research fields include planarization CMP technology for semiconductor devices, grinding and cutting processes for gears, thin-film formation by spray coating process, measurement and evaluation of gear accuracy, characterization of surface topography, and nanomachining of micro machine elements and measuring devices. He is a member of the JSAT, JSME, JSPE, and IEEE. He was awarded as JSME fellow since 2015, and is currently Vice President of JSPE, Chairman of the Planarization and CMP Technical Committee, Vice-President and Executive Committee Member of International Conference on Planarization/CMP Technology, and Project General Manager of JSME section meeting.

 

Perfecting the Chip: CMP Applications and Abrasives in Semiconductor Manufacturing

Dr. Kuo Chun Wu
Vice President, New Business Development, Wafer Works Corp., Ltd, Taiwan

 

 

 

Biography:
  Dr. KuoChun (KC) Wu has an extensive professional background in the semiconductor industry, having held various key roles in both business and research and development. His career highlights include:
•    Vice President, New Business Development at Wafer Works Corp.
•    General Manager, Global Marketing, and R&D Director at CMC Materials.
•    Vice President of Technology Transfer Management at Ultratech.
•    Director of Technology Development at Semiconductor Manufacturing International Corporation (SMIC).
•    Technical Manager at Mosel-Vitelic.
•    Senior Process Engineer at Applied Materials.
    In addition to his corporate role, Dr. Wu serves as an Adjunct Professor at National Taiwan University (ME) and National Tsing-Hua University (IEEM). He also holds a position as a board director at CMPUG Taiwan.Dr. Wu's academic achievements include a B.S. degree in Mechanical Engineering from National Taiwan University, as well as Master and Ph.D. degrees in Mechanical Engineering from the Massachusetts Institute of Technology (MIT). Additionally, he holds an Executive M.B.A. degree from the China Europe International Business School (CEIBS).

 

Ultra-Precision Grinding of Micro Cylindrical Lens Array Mold

Dr. Peng Yao
Associate Dean and Professor in School of Mechanical engineering of Shandong University, China

 

 

 

Biography:
    Dr. Peng Yao is currently an Associate Dean and Prof. in School of Mechanical engineering of Shandong University. He joined the faculty of the Shandong University in 2012. From 2005 to 2007, he held research and faculty positions at Northeastern University in China. In 2011, He got his PH.D. from Department of Nanomechanics, Graduate School of Engineering of Tohoku University in Japan. He was a visiting professor at University of Rochester. The research interest is the theory and technology of multi-energy assisted ultra-precision and high-efficiency machining of difficult-to-machine optical materials. He is the principal investigator of over ten national-level and ministerial-level scientific research projects, published more than 100 papers, holds 30 authorized patents. He is a member of the International Committee of Abrasive Technology (ICAT), a member of the Committee of Abrasive Technology and the Committee of Precision Machining and Micro/Nano Manufacturing of the Production Engineering Branch of the CSME.